Testing a more durable connection between components in chips

10 May 2024 Research news item

At Radboud University, researchers are investigating a more robust connection method between components in chips. According to researcher John Schermer, it includes the intermediary processes involved in their connectivity.

We also get to take a look at the lab, where researcher Fatin Battal has good news about the latest tests.

Listen to the Podcast van BNR radio (10-5-2024):
https://www.bnr.nl/podcast/wetenschap-vandaag/10546733/hier-testen-ze-een-duurzamere-verbinding-tussen-onderdelen-in-chips

Contact information

Contact: Dr J.J. Schermer (John)
Organizational unit: Institute for Molecules and Materials, Applied Materials Science
About person: Dr J.J. Schermer (John)
Theme: Innovation, Molecules and materials, Science