Testing a more durable connection between components in chips

At Radboud University, researchers are investigating a more robust connection method between components in chips. According to researcher John Schermer, it includes the intermediary processes involved in their connectivity.

We also get to take a look at the lab, where researcher Fatin Battal has good news about the latest tests. 

Listen to the Podcast van BNR radio (10-5-2024):

Contact information

Innovation, Molecules and materials, Science