Fatin was awarded the ECTC Student Travel Grant by the IEEE Electronics Packaging Society (EPS), in recognition of his work titled "Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects".
The work was developed at the Applied Materials Department of Radboud University IMM, in collaboration with researchers from TU Delft, CITC and Nexperia, within the framework of the Circular Circuits Program.
